Alignment is performed through a PC control system, using a 19.5-inch high-definition industrial display screen and a 15 inch high-definition industrial display screen for operation. Independently controlled three temperature zones, heated by convective hot air, with adjustable height in the lower temperature zone and built-in vacuum suction tube in the upper temperature zone for BGA adsorption, it is equipped with negative pressure monitoring and pressure protection device; The IR preheating temperature zone adopts carbon fiber infrared tube heating and high-temperature resistant microcrystalline panel protection, which can be moved left and right for easy maintenance of large and irregular PCBA. Adopting a high-definition CCD high-precision optical alignment system, it can ensure the precise placement of components. Equipped with laser red dot positioning, it guides the rapid positioning of PCBs. The placement system adopts multiple working modes, without the need to set complex locking parameters.
| 型號 | ZM-R750 | |
|---|---|---|
| Equipment Performance Parameters | Power Supply | AC380V±10% 50/60HZ |
| Power | 7.75KW (Max) Top zone (1.45KW) Buttom zone (1.2KW) Preheating zone (4.8KW) Other (0.3KW) | |
| PCB Size | 632x520mm(Max); 6x6mm(Min) | |
| BGA Chip Size | 80x80mm(Max) ;3x3mm (Min) | |
| IR Temp. Zone Size | 570x435mm | |
| Control System | Industrial PC+motion controller+temperature control module | |
| Temp. Sensor | 5 PCS | |
| Vacuum Adsorption | Automatic | |
| Alignment System | High-definition optical alignment system, automatic optical focuusing+laser red dot indicator | |
| Alignment Accurcacy | ±0.01mm | |
| Temp. Control | K-type thermocouple closed-loop control with accuracy up to ±1°C | |
| Dimensions | L1000xW835xH960mm | |
| Weight | 130.5KG |
