SP3100 is a pre-programmed SMT solder paste printing automatic optical inspection equipment, equipped with multi angle RGBW light source, two sets of small angle projection systems, high-resolution industrial camera with telecentric lens, and high-precision automatic Z-axis module. The equipment scans the solder paste on the surface of the PCB in a 2D+3D manner and generates three-dimensional contour data through phase shift technology. It can measure the height, volume, area, etc. of the solder paste with an accuracy of micrometers and is suitable for complex processes. It can achieve high-precision 3D automatic inspection and inspect defects such as excessive tin, insufficient tin, missing printing, bridging, copper leakage, and offset.