Fully automatic inline tin-removal/reballing/soldering equipment, suitable for repairing defective products in the semiconductor chip packaging process, using a single-point laser reballing and soldering system, human-machine control, intelligent motion system, can store multiple sets of product formula programs, simple line change and fast standard SMT runner-type loading and unloading, adjustable ESD synchronous belt components can be connected to other process equipment at the front and end of the production line, with strong overall compatibility, compatible with BGA industry standard trays.