R8650C is a BGA rework station with automatic visual alignment. lt is suitable for automatic rework of various SMD devices on large PCB boards (such as 5G communication boards). lt can realize automatic visual placement, automatic soldering, full automatic rework Automatic desoldering function. lt can be connected with MES software (optional) to realize the functions of temperature curve analysis with S/N as the traceability condition.
| 型號(hào) | ZM-R8650C | |
|---|---|---|
| Equipment Performance Parameters | Power Supply | AC380V±10% 50/60HZ |
| Power | Total power 22KW Top zone (2KW) Buttom zone (2KW) Preheating zone (16KW) Other (2KW) | |
| PCB Size | 660x600mm(Max); 10x10mm(Min) | |
| BGA Chip Size | 100×100mm（Max）；1x1mm（Min） | |
| IR Temp. Zone Size | 645x524mm | |
| Motion Control | X/Y/Z | |
| Temp. Sensor | 8 PCS | |
| Control System | Industrial PC+Servo motion control system | |
| Display System | 24“ HD display | |
| Alignment System | 2 million visual alignment system | |
| Vacuum Adsorption | Full automatic | |
| Alignmenr Accuracy | ±0.025mm | |
| Temp. Control | K-type thermocouple closed-loop control with accuracy up to ±1°C | |
| Feeding Device | Semi-automatic | |
| Positioning | L-groove and universal fixture (shaped fixture can be customized) | |
| Dimensions | L1235xW1557×H1850mm | |
| Weight | 993.5KG |
